| 摘要 |
PURPOSE: A manufacturing method of an encapsulated semiconductor chip package is provided to ensure correct depth control of a heat interface material by making a cover using a molding instead of a milling. CONSTITUTION: A cover(23) is prepared to eliminate a milling process. The cover(23) is made of a heat spreader selected from a group including Al, Cu, CuW and AlSiC, and surfaced treated with Ni, Au or Ag. Pluralities of semiconductor chips(11,12,13) are bonded to a PCB(21) via bumps(115,116,117). A space between the semiconductor chips(11,12,13) and the PCB(21) is filled with an encapsulation material(19) and attached with the cover(23). A heat interface material(27) is inserted at the backside of the semiconductor chip(11). Cavities in the cover(23) are manufactured through a molding instead of a milling to reduce errors. Correct depth control is made to the heat interface material.
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