METHOD FOR REMOVING CHIPS OF DEFLECTOR ROLL USING HYDROCHLORIC ACID SOLUTION

摘要

PURPOSE: A method and a chip removing apparatus used in the method are provided to restrain and remove growth of chips adhered to the surface of a deflector roll in the Zn-Ni plating process using a hydrochloric acid solution. CONSTITUTION: In a method for plating a strip by passing through a conductor roll dipped in a Zn-Ni plating bath and a conductor roll placed at the upper side of the plating bath, the method for removing chips of a deflector roll using a hydrochloric acid solution comprises the process of washing the chip removed deflector roll after removing chips by stopping current supply of the conductor roll when chips are generated on the surface of the deflector roll, and dipping and rotating the deflector roll in a 15 to 35 wt.% of a hydrochloric acid solution. In a plating apparatus comprising a plating bath, a conductor roll dipped into the plating bath for conducting a strip, and a deflector roll (40) transferring the plated strip at the upper side of the plating bath, the apparatus for removing chips of the deflector roll comprises a solution carrying part (110) installed at the lower side of the deflector roll (40) so as to dip the lower part of the deflector roll when a hydrochloric acid solution is supplied to the inside of the solution carrying part; a hydrochloric acid solution supplying part (120) supplying hydrochloric acid to the lower part of the solution carrying part (110) through a hydrochloric acid solution supplying tube (122); and a washing part (130) installed at the lower side of the deflector roll (40) for washing the deflector roll.