HEAT-RADIATING SEMICONDUCTOR PACKAGE AND MEMORY MODULE HAVING THE SAME

摘要

PURPOSE: A heat-radiating semiconductor package is provided to simplify a packaging process by omitting a process for adhering an additional heat sink, and to prevent the increase of the package in thickness by forming a structure functioning as a heat sink in the package as one body with the package. CONSTITUTION: A receiving groove is formed in the surface of a ceramic body(20), wherein stepped surfaces composed of upper and lower steps are formed on a sidewall of the receiving groove. A metal lead(30) is plated in a sidewall portion located on the upper and lower stepped surface and between the upper and lower stepped surfaces. A thermoplastic insulating part(50) surrounds the periphery of the ceramic body. A semiconductor chip(10) is adhered to the lower surface of the receiving groove, wherein a bonding pad(11) is disposed on the surface of the semiconductor chip. A metal wire electrically connects the bonding pad of the semiconductor chip with the metal lead portion formed on the lower stepped surface. An encapsulating material(70) is buried inside the receiving groove so that the metal lead portion plated on the upper stepped surface is exposed. A solder ball(80) is mounted in the metal lead portion plated on the upper stepped surface.