| 摘要 |
PURPOSE: A stacked chip package using a lead frame is provided to minimize the height of an overall package, by using the lead frame including a die pad having a slot, and by making the lower surfaces of stacked semiconductor chips adhered to each other through the slot. CONSTITUTION: A lead frame(240) has a die pad(246) having a slot, inner leads(242) disposed around the die pad and outer leads(244) formed in the inner leads as one body. The first semiconductor chip(210) is mounted on the die pad. The second semiconductor chip(220) is mounted in the first semiconductor chip. Bonding wires(250) electrically connect bonding pads of the first and second semiconductor chips with the inner leads. Molding resin(260) seals the first and second semiconductor chips, the bonding wires, the die pad and the inner leads. The lower surface of the second semiconductor chip is adhered to the lower surface of the first semiconductor chip through the slot of the die pad. The first and second bonding pads(212,222) are connected to the upper and lower surfaces of the inner leads, respectively.
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