发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
摘要 PURPOSE: A substrate processing apparatus is provided to improve the uniformity of processing by applying a coating processing, while keeping a board in high accuracy in coating and developing devices. CONSTITUTION: The substrate processing apparatus comprises a developing unit(D1), a coating unit(C1) and a plurality of cooling parts(4) which are placed in sequence from the upper side in a processing station for coating a resist. The apparatus, moreover, includes a substrate transfer device(MA) for transferring the substrate cooled in the cooling part to the coating unit(C1), a temperature detector(3A) for detecting the temperature of the area transferred by the substrate transfer device(MA), and a controller(30) for adjusting the temperature of the substrate cooled in the cooling part(4) based on a value detected by the temperature detector(3A) until the temperature of the substrate transferred to the coating unit(C1) become the coating temperature at the time of coating the resist liquid.
申请公布号 KR20010062561(A) 申请公布日期 2001.07.07
申请号 KR20000079344 申请日期 2000.12.20
申请人 TOKYO ELECTRON LIMITED 发明人 AOYAMA TORU;IWAKI HIROYUKI;KATANO TAKAYUKI;KITANO JUNICHI;MATSUI HIDEFUMI;SHIMURA SATORU;SUZUKI YO;YAMASHITA MASAMI
分类号 H01L21/027;B05C11/08;H01L21/00;H01L21/677;(IPC1-7):H01L21/027 主分类号 H01L21/027
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