CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a chip scale package(CSP) is provided to control a crack in a solder ball, by making an elastic layer absorb stress generated by a difference of thermal expansion coefficient between a package mounting board and a semiconductor chip. CONSTITUTION: An interconnection board is prepared. An elastic layer(27) of the interconnection board is adhered to a semiconductor chip(10). The adhered interconnection board and semiconductor chip are transfer-molded to encapsulate all of the semiconductor chip with an encapsulating material(50). A via hole of the interconnection board is filled with a conductive solder(60) while a solder ball(70) is placed on a ball land of a metal pattern(21) of the interconnection board. A reflow process is performed to heat the resultant structure by using infrared rays so that the conductive solder is connected to a bonding pad(11) of the semiconductor chip while the solder ball is connected to the ball land of the metal pattern.