PATTERN FOR TESTING RELIABILITY OF METAL INTERCONNECTION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A pattern for testing reliability of a metal interconnection of a semiconductor device is provided to decrease the number of test samples and to reduce test time by testing reliability of a metal interconnection or via contact by a simplified test structure, and to select a line width and a via contact of the metal interconnection of superior reliability by testing relative superior reliability within a shortest interval of time regarding at least two interconnection structures. CONSTITUTION: Metal interconnections(10) having different sizes are connected in parallel. A test pattern is so formed that a test is continuously performed even if one of the metal interconnections having different sizes is disconnected.