MOLDING DIE FOR FINE PITCH BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A molding die for a fine pitch ball grid array(FBGA) package is provided to easily inspect whether a marking type formed by a marking process is in its right position by comparing a lustrous surface or line with the position of the marking type, by forming the lustrous surface or line on the bottom surface of a mat-processed cavity. CONSTITUTION: Liquid molding resin is injected to a port. A half-finished fine pitch ball grid array(FBGA) package(140) is inserted into a cavity(116) of which the bottom surface is processed to be like a mat. A runner(114) guides the liquid molding resin injected to the port to the cavity. The bottom surface portion of the mat-processed cavity which corresponds to a marking position of the molding sealing part formed by the molding resin injected into the cavity is sawed and separated into an individual package, is a lustrous surface.