SLURRY FOR CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: To provide a slurry for chemical mechanical polishing which inhibits the adhesion of polished products to polishing pads and yields fine polished products via a single polishing operation without interrupting the polishing operation, even when polishing a large amount of copper metals. CONSTITUTION: The slurry for chemical mechanical polishing for polishing base plates having copper or copper alloy films on their surface, contains an abrasive, an oxidizing agent and citric acid as an inhibitor which inhibits the adhesion of polishing products to a polishing pad.