DIE BONDER AND/OR WIRE BONDER INCLUDING ABSORPTION APPARATUS FOR UNFOLDING BENT SUBSTRATE

摘要

PURPOSE: A die bonder and/or wire bonder including an absorption apparatus is provided to unfold a bent substrate and maintain the unfolded substrate, by making a substrate include at least one cavity connected to a support surface and by installing a vacuum gripper inside the cavity. CONSTITUTION: A metal plate(1) includes the support surface(2) regarding the substrate(3) and at least one cavity(7) connected to the support surface. The vacuum gripper(8.1,8.3) made of a soft material is positioned inside the cavity. A raising unit raises the vacuum gripper to the level of the support surface to supply absorption to the substrate. A lowering unit lowers the vacuum gripper to the cavity while the substrate is transferred.