MEMORY MODULE

摘要

PURPOSE: A memory module is provided to be capable of preventing a sealing agent from flowing into an unnecessary portion without installing a separate dam. CONSTITUTION: A reception groove is formed at both surfaces of a board(10). A plurality of circuit patterns are arranged in the board. A via hole(12) is formed at the board between the reception grooves. A metal film is coated on each via hole. Each circuit pattern is electrically connected through the metal film. Two semiconductor packages(20) having a solder ball(21) as an external terminal are received in the reception groove, and the solder ball(21) is mounted on the via hole. A space between each semiconductor package and an inner wall of the groove is under filled by a sealing agent(30).