| 摘要 |
PURPOSE: To provide a lead frame 6, which has a wiring means capable of connecting electrically a plurality of semiconductor components 7 and 7 with each other and makes it possible to mount the components on one semiconductor device without increasing the manhour of assembly while the thickness of the device is made thin and moreover, without reducing the reliability of the elements or the yield of the manufacture of the components. CONSTITUTION: A lead frame has outer leads 3 consisting of a metal base material 1, wiring films 2, which are respectively connected with the outer leads 3 at the inner end parts of the surfaces on one side of the surfaces of the outer leads 3 on the insides of the outer leads 3 and consist of a metal plating layer, a wiring film 2s liberated from the outer leads and an insulating film 5 to hold each wiring film of the wiring films 2 and 2s in such a way as to cover the wiring films 2 and 2s from the surfaces, which are positioned on the side opposite to the outer leads, of the films 2 and 2s and the surfaces, which are positioned on the side opposite to the film 5, of the films 2 and 2s are used as semiconductor component mounting surfaces. |
