| 摘要 |
PURPOSE: A method and device for forming resin film are provide to set time required for a base film to pass a dry part to be almost equal, even with different device region length, when related to manufacturing of TCP, drying a resin film coated to seal a semiconductor chip mounted in each device region of a long base film. CONSTITUTION: Six nozzles(61) are used to coat resin, if the length of a device region corresponds to, for example, three times the pitch of the sprocket hole of a base film(11), while three nozzle(61) are used to coat resin, if it corresponds to, for example, six times the pitch of sprocket hole. Thus in either case, the transfer distance of the base film(11) in a single resin coating process comes to 18 times the pitch of sprocket hole. So, even with different lengths for the device region, the time required for the base film(11) to pass the dry part(3) can be mode equal. |
