| 摘要 |
PURPOSE: To provide a semiconductor light-emitting element which can prevent occurrence of short circuits caused by the adhesion of solder, shape variations in emitted light, and decline in its light output, a method of manufacturing the element, and an installation substrate used for the element. CONSTITUTION: A semiconductor laser element 1 is manufactured by sticking a laser chip 20, constituted by forming a p-side electrode 2a and an n-side electrode 2b on a crystalline substrate 21 to an installation substrate 30, constituted by forming first and second solder films 3a and 3b on a support body 31. The chip 20 has a step A that has the electrode 2a protruded more than the electrode 2b. The substrate 30 has a step B where a fist solder film 4a protrudes more than the second solder film 4b and is higher than the step A. At sticking of the chip 20 to the substrate 30, consequently the electrode 2b first comes into contact with the second solder film 4b, and thereafter, the electrode 2b comes in to contact with the second solder film 4b. Accordingly, the protrusion of solder is less likcly to occur to near the electrode 2a, even if the protrusion of solder occurs near the electrode 2b. Since a p-n junction is generally provided near the electrode 2a, the adhesion of solder to the junction is suppressed.
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