| 摘要 |
PURPOSE: A dual die package is provided to prevent interface peeling and package cracks by decreasing the bonding interface among lids for the reduction of hydroscopic paths. CONSTITUTION: A dual die package(10) has two semiconductor chips(11,13) in a central portion of an active surface thereof, and bonding pads(12,14) are arranged in the semiconductor chip(11,13). The upper first semiconductor chip(11) is mounted to an upper lead(21), and the lower second semiconductor chip(13) is attached to a lower lead(23). The first and second semiconductor chips(11,13) are positioned between the upper and lower leads(21,23). The upper lead(21) is upwardly bent, and the lower lead(23) is downwardly bent. Each of bent points of the leads(21,23) is in the outermost of a package body(41). The upper and lower leads(21,23) are electrically connected, and the upper lead(21) acts as a common connection terminal.
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