发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE: To provide a semiconductor device having a high reliability by improving the adhesion of a layer insulation film to prevent the layer insulation film between wirings from peeling off and blocking cracks in the layer insulation film from propagating. CONSTITUTION: In the semiconductor device formed by laminating first dummy wirings, a layer insulation film and second dummy wirings in this order on a semiconductor chip and forming a plurality of dummy vias into the layer insulation film between the first and second dummy wirings, one of the first dummy wirings or the second dummy wirings is connected to the plurality of dummy vias.
申请公布号 KR20010062130(A) 申请公布日期 2001.07.07
申请号 KR20000073280 申请日期 2000.12.05
申请人 SHARP CORPORATION 发明人 HAGIWARA HIDETOSHI
分类号 H01L23/52;H01L21/3205;H01L21/48;H01L23/544;(IPC1-7):H01L21/28 主分类号 H01L23/52
代理机构 代理人
主权项
地址