| 摘要 |
PURPOSE: A lifting device for a semiconductor wafer is provided to prevent the semiconductor wafer from separating from a lifter when the semiconductor wafer is lifted by the lifter. CONSTITUTION: A lifting device comprises at least three lifting pins(13) which support a rear side of a wafer and a driving device for simultaneously lifting the lifting pins(13) for loading/unloading the wafer into/from a wafer stage. Each lifting pin(13) consists of a plurality of conductive members both ends of which are insulated. A tip section making contact with the rear side of the wafer is coated with a dielectric material. A DC power supplying device(14) is connected to other ends of the conductive members so as to give different poles to the other ends of the conductive members.
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