| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the dimensional accuracy of a resin case frame by overcoming an increase in the man-hour of needing annealing by a deformation preventive form as a strain countermeasure of contracting deformation of the case frame at the molding time, in a method for omitting an adhering step needing the adhering step of a metal base to the case frame in a conventional semiconductor device. SOLUTION: A protruding strip 8 is formed on the inner wall of a skirt 5a of the resin case frame 5. Thus, the engaging properties of the frame 5 with the metal base 2 is enhanced.</p> |
