| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, its manufacturing method, a manufacturing apparatus of the manufacturing method, a circuit substrate, and an electronic apparatus in which a ring is not used and a manufacturing step is superior. SOLUTION: This method comprises the steps of: engaging an elongated tape 20 between a pair of reels 22, 24, and while the tape 20 is fed out from the one reel 22 to the other reel 24, sticking a cutting member containing a plurality of semiconductor elements to the tape 20; and dicing the cutting member stuck to the tape 20 to several pieces in each of the semiconductor elements.</p> |
