CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR AND MATERIAL PIECE FOR CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board, a method for manufacturing it and a material piece for the circuit board having excellent noise absorption and capable of reducing in size. SOLUTION: The circuit board is obtained by forming a plurality of one electrode films 16 on an insulating layer 18 of the uppermost layer, forming a ferroelectric layer 11 having larger dielectric constant than that of the layer corresponding to the each one film 16, forming the other electrode film 22 on the layer 11, and forming a plurality of bypass capacitors 25 connected to the power terminal of a mounting semiconductor chip 27.