发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT CONTAINING DIELECTRIC LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component containing dielectric layers wherein it is not necessary to increase the content of a sintering assistant and the like in a dielectric composition constituting the dielectric layers, a low temperature baking is possible, a fine sintered body can be obtained and further electrical characteristics such as dielectric constant are superior. SOLUTION: The method of manufacturing an electronic component containing dielectric layers comprises a step of preparing a pre-sintering element body 10a including a dielectric layer 2 and a step of supplying the pre-sintering element body 10a together with supply source materials 12 including lithium, boron and/or sodium in a baking furnace and carrying out baking. The pre- sintering element body 10a, for example, is composed of a laminating body of the dielectric layer 2 and an internal electrode layer 3, and becomes an element body of the laminated ceramic capacitor. The internal electrode layer 3 comprises an electro-conductive layer including a base metal, and it is preferable to carry out baking in a baking furnace with a reducing atmosphere.
申请公布号 JP2001185438(A) 申请公布日期 2001.07.06
申请号 JP19990363816 申请日期 1999.12.22
申请人 TDK CORP 发明人 MIYAUCHI MARI;NAKANO YUKIE
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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