CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A circuit board and a manufacturing method of the same are provided to be capable of minimizing the dielectric loss in fast data transmission and the distortion of transmission signals by separating a portion of transmission lines from an insulating board to reduce the effective transmissivity between the transmission lines and a ground. CONSTITUTION: A ground(13) of conductive metal is disposed on at least one surface of an insulating board(11). A plurality of transmission lines(20) are disposed on one surface of the insulating board(11) to be spaced from the insulating board. A plurality of supporters(30) are disposed between the respective transmission lines(20) and the insulating board(11) for assuring the space between the transmission line and the insulating board. The insulating board(11) consists of material such as FR4/epoxy, ceramic, Teflon, etc. The ground(13) is formed on one surface of the insulating board by a compression method for preventing the influence of electric signals.