METHOD FOR ATTACHING WAFERS AND APPARATUS THEREOF

摘要

PURPOSE: A method for attaching wafers is provided to minimize the defective rate of wafers due to incorrect supply of ball solders and significantly improve the productivity by correctly supplying the ball solders on the wafers in a dot mode. CONSTITUTION: A method for attaching wafers includes a surface check step(100), a ball solder inhalation step(101) and an attach step(102). The surface check step(100) pre-checks the surface of a wafer to be experienced by an attach process and transmit its data to a control unit(100). The ball solder inhalation step(101) inhales the ball solders into an inhalation hole of an attach plate having a given size to contain the inhalation hole in the ball solder. The attach step(102) divides the wafer into a plurality of blocks having a given size and sequentially continuously attaches respective blocks onto the attach plate.