发明名称 WIRING BOARD FOR HIGH FREQUENCY
摘要 PROBLEM TO BE SOLVED: To enable high-precision impedance matching, to eliminate high-frequency inconsistency, and to reduce the reflection loss of a high-frequency signal further. SOLUTION: This board is equipped with a high-frequency input/output part where ground conductors 4 and 7 of both coplanar lines 5 and 8 are electrically connected to each other by a through conductor 10 electrically connected to internal-layer ground conductors 9a and 9b of two layers at positions of 0.1 to 5 mm on both sides in the direction crossing the 1st and 2nd coplanar lines 5 and 8 at right angles from the through conductor 10; and the ground through conductor is composed of an upper ground through conductor 11a which connects the ground conductor 4 and internal-layer ground conductor 9b right below it, a lower ground through conductor 11b which connects the ground conductor 7 and the internal-layer ground conductor 9b right above it, and an intermediate part ground through conductor 14 which connects the internal-layer ground conductors 9a and 9b to each other and the intermediate-part ground through conductor 14 is closer to the through conductor 10 than the upper ground through conductor 11a and lower ground through conductor 11b.
申请公布号 JP2001185918(A) 申请公布日期 2001.07.06
申请号 JP19990366832 申请日期 1999.12.24
申请人 KYOCERA CORP 发明人 SAWA YOSHINOBU
分类号 H01L23/12;H01P1/04;H01P3/02;H01P5/08 主分类号 H01L23/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利