摘要 |
<p>PROBLEM TO BE SOLVED: To decrease mask slips during drawing and to improve the yield of products by an improvement in position accuracy in an electron beam drawing process for executing pattern formation to a mask. SOLUTION: A top table 1 on a drawing table of an electron beam drawing system has a smooth surface composed of a dielectric material 1a and is constituted by embedding an electrode 3 connected to from a DC power source 2 therein. A mask substrate 4 consists of a shading film 8 formed on its main surface, an electron beam resist 9 covering the top thereof and conductive films 5 formed on flanks and rear surface side. The conductive films 5 of the mask substrate 4 placed on the top table 1 are grounded, by which circuits are formed among the DC power source 2, the electrode 3, the dielectric material 1a and the mask substrate 4. The electron beam resist 9 is irradiated with electron beams 7 in the state of surely holding and fixing the mask substrate 4 to the top table 1 by the electrostatic attraction force generated by impressing DC voltage to these circuits, by which mask patterns are drawn.</p> |