| 摘要 |
PURPOSE: A semiconductor package is to manufacture a semiconductor package without sawing a wafer by forming the terraced lead, and to obtain a high integration of the semiconductor package. CONSTITUTION: A lead of a lead frame is formed to have a step difference(14). The lead is stepped twice. A chip mounting plate(24) is parallel to a lower end of the lead. Using an attaching material, a semiconductor chip is attached to the chip mounting plate. A wire is then bonded between the step difference of the lead and a bonding pad. To protect the lead and the wire, molding is performed using resin(18). An exposed upper lead surface is positioned on both ends of a semiconductor package. A lower lead surface is exposed toward an inner position from the both ends of a bottom surface in the semiconductor package. A solder ball as an input/output unit is attached to the exposed upper/lower surface. |
