METHOD FOR LAMINATING CIRCUIT TAPE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for laminating a circuit tape for a semiconductor package is provided to perfectly form a clean punching, by laminating the circuit tape after a window of a predetermined size is formed in elastomer, and by forming a window only in the laminated circuit tape. CONSTITUTION: Elastomer of a predetermined length is prepared which has adhesion on its upper and lower surfaces and protection films adhered to the upper and lower surfaces. A plurality of windows are formed in the elastomer. A circuit tape is prepared which has a circuit pattern unit composed of a plurality of rows and columns. The protection film adhered to one surface of the elastomer is stripped off, and the circuit tape is laminated on the elastomer. A window of a predetermined size is formed in a region corresponding to a window formed in the elastomer of the circuit tape. The protection film adhered to the other surface of the elastomer is stripped off.