| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film electronic component which can prevent generation of cracks in an insulator layer and assure insulation performance. SOLUTION: This electronic component comprises a supporting substrate 1, a thin film element A provided on the supporting substrate 1 and having an insulator layer 3 and electrode layers 5, 7, a protective layer 9 for covering a non-formation area of insulator layer B wherein the thin film element A and the insulator layer 3 are not formed, and solder bumps 11 that are provided on the protective layer 9. In addition, the protective layer 9 in the non-formation area of insulator layer B is provided with through-holes 13a, 13b and the solder bumps 11 are electrically connected to the layers 5, 7 via a solder scatter protection metal 17 in the through-holes 13a, 13b. |
