| 摘要 |
<p>PROBLEM TO BE SOLVED: To execute good solder bonding and hence to improve a manufacturing efficiency and to enhance its quality by suppressing the positional deviation of a semiconductor pellet due to flowing of a solder or a withstand fault caused by a solder bridge at the pellet soldering time. SOLUTION: In the ceramic circuit board 1, a metal circuit board 2a is bonded onto the board 1, and the semiconductor pellet 3 is bonded to the board 2a by the solder 4. In this case, a solder resist layer 7 is provided at a site not coated with the solder 4 of the pellet 3 mounting surface of the board 2a.</p> |
