METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP SCALE PACKAGE AND PACKAGE THEREOF

摘要

PURPOSE: A method for manufacturing a semiconductor chip scale package and a package thereof are provided to perform a buffering function and a distortion prevention function by using an elastomer circuit plate. CONSTITUTION: A pad(501) is formed and cut when designing a chip(500). A gold lead frame is formed by a stamping process. A lead(511) of the gold lead frame is molded to a U shape. An elastomer circuit plate(520) including a thin film type printed circuit board and a ball land(523) is manufactured. A sliding plate(521) is adhered to the elastomer circuit plate(520). The lead(511) of the gold lead frame is bonded to the elastomer circuit plate(520) by using a torch. An adhering portion is formed on the sliding plate(521). The chip(500) is bonded to the adhering portion. A spot lead bonding process for the lead(511) of the gold lead frame and the pad(501) of the chip(500) is performed. A plating process for the bonded lead(511) is performed. The lead(511) is removed by trimming the lead(511). A solder ball(570) is mounted on the ball land(523).