摘要 |
PURPOSE: A dispense device is to suppress generation of foreign matters caused by solidification of an SOG(spin on glass) solution by removing a nozzle head and changing a cleaning manner of a supplying nozzle. CONSTITUTION: A supplying nozzle(51) supplies an SOG solution to a wafer to apply an SOG coating to the wafer. The supplying nozzle is moved to an SOG coating position and a rinse position by a nozzle arm. A receive cap(53) is located below the supplying nozzle to clean the supplying nozzle when it is moved to the rinse position. A cleaning fluid supplying tube(55) located at the receive cap injects a cleaning fluid towards the supplying nozzle to remove the SOG solution smeared at an end of the supplying nozzle when the nozzle is moved to the rinse position. At least two cleaning fluid supplying tubes are formed at a circumference of the receive cap. A drain port(57) is formed at the receive cap to discharge the cleaning fluid being dropped after being injected through the cleaning fluid supplying tube to clean the supplying nozzle. An assistant supplying tube(59) is formed between the cleaning fluid supplying tube and the drain port to flow additional cleaning fluid to the drain port.
|