| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact structure of IC socket which can keep a uniform contact, even if an IC package is warped by the heat applied at the burn-in test or the like. SOLUTION: Partial deterioration of a contact 4 is prevented by forming a surface 4a of a contact 4, formed by an elastic body 7 of electric conductive rubber and film, into curvature shape in conformity with the warpage of a specified IC package 1a, and by making an IC lead contact closely with the contact 4.
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