| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting an IC chip to a circuit board capable of connecting an IC chip to the circuit board with high productivity and reliability. SOLUTION: The IC chip is mounted on a hole 15 corresponding to an electrode 2 or an electrode 5 of the circuit board 4 at a depth deeper than a thickness tpc of a passivation layer 1a coated on an electrode of the chip and shallower than a thickness te of an electrode of the circuit board. The chip is arranged in the connecting direction of the chip electrode and the board electrode with each other by interposing a solid insulating thermosetting resin sheet 66 with a conductive particle 16 embedded therein. In the end, the chip is bonded to press it to the board by supplying ultrasonic vibration and thermally curing the resin sheet while heating altogether. |
