| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a producing method for a multilayer printed wiring board which reduces void, warp or twist which easily occur at the spot of a low residual copper rate on an inner layer circuit board. SOLUTION: Concerning the producing method for a multilayer printed wiring board constituted by laminating and molding through a prepreg outer layer metal foil and an inner layer circuit board having mutually separated circuit groups on the same face, a dummy printed circuit board with which a similar pattern is formed in the area with no circuit on the inner layer circuit board is placed at the stage internal position of a press, heated and pressed.</p> |
