发明名称 MULTILAYERED PRINTED WIRING BOARD AND PRODUCING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board which has a low-cost partially non-multilayered structure without requiring special materials, processing, working or skilled techniques, and a producing method therefor. SOLUTION: Concerning a multilayered printed wiring board, a dam member 14 for preventing a resin flow at the time of lamination is provided around the part where the number of layers is decreased. Thus, since the resin flow at the time of lamination can be effectively blocked without using special materials or processing, cost-down and yield improvement can be attained. The producing method for this multilayered printed wiring board has a process for forming a dam 14 for preventing resin flow by screen printing or the like corresponding to a notched part 13 for detaching a removal scheduled part.
申请公布号 JP2001185854(A) 申请公布日期 2001.07.06
申请号 JP19990365647 申请日期 1999.12.22
申请人 TOSHIBA CORP 发明人 KAMEGAWA NAOTO;TAGUCHI MASAYUKI;SEKINE NORIAKI
分类号 H05K1/02;H05K3/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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