| 摘要 |
PROBLEM TO BE SOLVED: To protect ceramic at the side part of a via against cracking or chipping at the time of making a via hole in a green sheet by punching, firing or breaking while reducing the size of a wiring board when a wiring board of multilayer ceramic structure having a via in the sealing face around a recess is produced. SOLUTION: A part of a ceramic layer forming a sealing face 115 is spread onto a face for forming a bonding pad 112 located close to the inner circumference thereof thus forming a wide part 117 and a via 121 is provided therein. Since the via 121 is provided in a wide part and a thickness can be ensured on the via side, troubles are prevented during production and the size of the board is reduced. |
