| 摘要 |
PROBLEM TO BE SOLVED: To provide a package technology for sealing an MEMS device hermetically so that the MEMS device can be built in a CMOS circuit. SOLUTION: The inventive package technology can be employed for packaging an MEMS device according to a conventional CMOS package technology. The invention also provides means for controlling the operational environment of the MEMS device. In the inventive package, a protected cavity is provided around an MEMS device fabricated by a flip-chip bonding process. According to one embodiment, a firewall is formed on a first substrate around the MEMS device which is sealed in a cavity bounded by the firewall. Subsequently, another substrate is flip-chip bonded to the first substrate holding the MEMS device. |
