| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame having a radiating function in a simple structure without conducting a secondary step such as a step of adhering a radiating plate. SOLUTION: The lead frame is formed by forming leads 2 of a secondary shape at least by plating on a conductive board 1, forming an insulating layer 3 covering the leads 2, forming openings at the layer 3 by partly exposing corresponding to the leads 2, respectively forming the external terminals 4 of the leads 2 in the openings, and then selectively etching the board 1 to form die pads 5 for supporting the independent leads supported to the layer 3 and the element. In this case, the pad 5 is formed partly at on the selectively etched board 1. Since a radiating action can be incorporated in an element mounting part, a problem of a thermally erroneous operation in association with enhanced performance of an LSI can be alleviated from the field of a member. Further, since a secondary step is not required such as adhering the radiating plate, its cost can be reduced. |
