ELECTRIC PLATING BARRIER LAYER

摘要

PROBLEM TO BE SOLVED: To provide a method for preparing a surface for depositing electrochemically. SOLUTION: This method comprises steps of: forming a high conductivity barrier layer on a surface; and depositing a seed layer on this high conductivity barrier layer. Furthermore, a method for filling a structure on a base is provided. This method comprise a step 302 of depositing the high conductivity barrier layer on one or more surfaces of the structure; a step 304 of depositing the seed layer on this barrier layer; and a step 306 of electrochemically depositing a metal to fill the structure.