SOLDER BALL SEAT OF BGA PACKAGE, SOLDER BALL MOUNTING DEVICE AND MOUNTING METHOD THEREOF

摘要

PURPOSE: A solder ball seat, a solder ball mounting device and its mounting method are to shorten a mounting time by saving a time for picking up and testing the solder ball and to save the cost of components. CONSTITUTION: A solder ball seat(51) has a solder member(52b) arranged at one side of an adhesive seat(52a) to be corresponding to a land part(17) of a substrate to which a solder ball is to be mounted. A heating pin is disposed to be corresponding to the solder member of the solder ball seat. The solder member is disposed at each land part of the substrate to be lifted with regard to the substrate and is heated by the heating pin to be connected to the land part. The solder member has a circular cylindrical shape to be surface contacted with the adhesive seat and the land part. The adhesive seat is separated from the solder member by heating the solder member. A support plate(62) is arranged parallel to the substrate and has the heating pin at its lower surface. A lifting cylinder(66) for lifting the support plate is disposed above the support plate. A through hole is formed through a rectangular flange(67).