<p>PURPOSE: A semiconductor package is provided to increase a mounting density and a memory capacity by laminating a multitude of semiconductor package having thin thickness. CONSTITUTION: A semiconductor chip(4) is located on within a well region of a center portion of a printed circuit board(2). A connection portion(8) connects an input/output pad of the semiconductor chip(4) with a circuit pattern of the printed circuit board(2). A multitude of conductive via hole(10) connects electrically a circuit pattern(6) of an upper face of the printed circuit board(2) with a circuit pattern of a lower face of the printed circuit board(2). A multitude of solder ball land(12) is formed on the upper face and the lower face of the printed circuit board(2). A resin encapsulant(16) protects the semiconductor chip(4) and the connection portion(8) from the outside.</p>
