| 摘要 |
PURPOSE: A method for producing semiconductor parts and a plating tool therefor are provided to use a plating technique eliminating or at least substantially reducing the undesired plating of the edge and back surfaces of the semiconductor substrate. CONSTITUTION: The method for producing semiconductor parts includes the steps of depositing the first electrically conductive layer on a substrate(270), forming a patterned plating mask on the first electrically conductive layer, connecting the first plating electrode(250) without piercing the plating mask to the first electrically conductive layer and plating the surface of the part of the first electrically conductive layer to form the second electrically conductive layer. The plating device for the above producing method contains an inner weir(220) located at the inside of an outer weir(210), an elastic member(230) on a rim of the outer weir, a pressure ring(240) located on the rim of the outer weir and the elastic member and a plurality of cathode contacts(250, 251, 252 and 253) located between the pressure ring and the outer weir. A substrate is arranged between the elastic member and the pressure ring.
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