SEMICONDUCTOR PACKAGE AND MOUNTING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to mounting density on a mother board, by electrically connecting the semiconductor package with the mother board when the semiconductor package is mounted on the mother board by using a circuit tape or printed circuit board(PCB). CONSTITUTION: A plurality of input/output pads(2a) are formed on an upper surface of a semiconductor chip(2). A circuit board has a contact pad(15) directly connected to a mother board and a bond finger(13) connected to the semiconductor chip, located on a lower surface of the semiconductor chip and having a larger area than that of the semiconductor chip. A connection unit electrically connects the input/output pad of the semiconductor chip with the bond finger of the circuit board. An encapsulant(30) seals and protects the semiconductor chip and the connection unit from the exterior surroundings.