| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder and a die-bonding method, which can shorten the stroke of a nozzle at the time of picking up the chip of a chip supply part, and shorten the tact time. SOLUTION: The nozzle 52 of a head part 300 reciprocates between a wafer 3 and a lead frame 1 by the drive of a liner motor part 20. A cam follower, provided at the mount 50 of the nozzle 52, shifts along a cam groove 61 of a cam 60. The cam groove 61 has a ramp 61c of downward slope toward the wafer 3, and when the nozzle 52 shifts toward the wafer 3, the nozzle 52 is lowered. The nozzle 52, having shifted onto the wafer 3 moves in the vertical direction by the stroke S2 by moving up and down, being driven by a motor, and picks up a chip P. Moreover, the nozzle 52 is made to take scrub action, to firmly bond the chip P to the lead frame 1.
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