| 摘要 |
PURPOSE: To observe and record the deformation amount of each inner conductor layer of a multilayer printed wiring board. CONSTITUTION: A solid guide mark 22 and a hollow guide mark 23 are formed at a conductor layer on the front and rear of a both-sided wiring board 61 for an inner layer of a multilayer printed wiring board 61. For example, a solid guide mark 22-1b is concentrically arranged with a hollow guide mark 23-2a provided at an adjoining conductor layer, forming the solid and hollow guide marks 22 and 23 arranged concentrically for each adjoining conductor layer. A pair of concentric solid and hollow guide marks 22 (1a-5a) and 23 (1b-5b) are arranged in, for example, three rows and three columns within a guide mark frame 21 whose profile is accommodated in the sight field of an X-ray camera. Guide mark groups 20 are provided at, for example, four corners of the multilayer printed wiring board. A single guide mark group takes in all guide mark images in the frame at a single X-ray irradiation, with the coordinate value calculated. Based on the coordinate value of a guide mark in four guide mark groups, the deformation amount of wiring pattern formed at each conductor layer is calculated and the result is recorded.
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