发明名称 |
FLOOR STRUCTURE, FLOORING JOINT SEAL, AND WIRING FLOORING |
摘要 |
PROBLEM TO BE SOLVED: To provide a floor structure capable of preventing warps of flooring materials even when temperature rises. SOLUTION: The floor structure 4 is constituted of wiring flooring materials 2 and flexible flooring joint seals 3. The wiring flooring materials 2 include projected pieces 2c projected to the sides of wiring gutters 5. The projected pieces 2c can be bent to downward sides. A gap S is made between one projected piece 2 and the other projected piece 2 of the wiring flooring materials arranged so as to abut against each other. The flooring joint seals 3 are stuck so as to lay them between the projected pieces 2c and 2c.
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申请公布号 |
JP2001182305(A) |
申请公布日期 |
2001.07.06 |
申请号 |
JP19990364537 |
申请日期 |
1999.12.22 |
申请人 |
MIRAI IND CO LTD |
发明人 |
SHIMIZU SHOHACHI |
分类号 |
E04F15/024;E04F15/18;(IPC1-7):E04F15/024 |
主分类号 |
E04F15/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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