发明名称 FLOOR STRUCTURE, FLOORING JOINT SEAL, AND WIRING FLOORING
摘要 PROBLEM TO BE SOLVED: To provide a floor structure capable of preventing warps of flooring materials even when temperature rises. SOLUTION: The floor structure 4 is constituted of wiring flooring materials 2 and flexible flooring joint seals 3. The wiring flooring materials 2 include projected pieces 2c projected to the sides of wiring gutters 5. The projected pieces 2c can be bent to downward sides. A gap S is made between one projected piece 2 and the other projected piece 2 of the wiring flooring materials arranged so as to abut against each other. The flooring joint seals 3 are stuck so as to lay them between the projected pieces 2c and 2c.
申请公布号 JP2001182305(A) 申请公布日期 2001.07.06
申请号 JP19990364537 申请日期 1999.12.22
申请人 MIRAI IND CO LTD 发明人 SHIMIZU SHOHACHI
分类号 E04F15/024;E04F15/18;(IPC1-7):E04F15/024 主分类号 E04F15/024
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