MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To solve the problem that a correspondent treatment is delayed so that a substrate of the following lot is embroiled to crack by the reason that a substrate crack can not be detected simultaneously with occurrence of the crack and productivity is lowered due to time loss for the recovery of the apparatus and line. SOLUTION: An AE sensor 9 for detecting AE wave generated when the crack of a glass substrate 5 occurs is installed in a processing vessel 6, and in response to the AE signal detected by the AE sensor 9, a control part controls the control sequence to conduct correspondent treatment. An AE generating part 24 for inspection is provided facilitate self-inspection on the accuracy of detecting AE signal.