| 摘要 |
PURPOSE: A polyamide resin composition for plating is provided which improves compatibility between the polyamide resin and a carboxylic acid reformed copolymer and has improved shock-resistance, heat-proof property, plating property and rigidity. CONSTITUTION: The polyamide resin composition for plating comprises: (i) 40-75 wt.% of polyamide 6 or polyamide 66 resin; (ii) 10-20 wt.% of a carboxylic acid reformed copolymer prepared by copolymerizing 40-80 wt.% of an aromatic vinyl compound, 15-35 wt.% of a vinyl cyan compound and 5-15 wt.% of α,β-unsaturated mono carboxylic acid; (iii) 5-10 wt.% of a butadiene containing styrenic rubber copolymer wherein 0.5-10 wt.% of an anhydrous maleic acid is grafted; and (iv) 10-30 wt.% of talc. |
