| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor ball grid array package is provided to prevent the missing ball phenomenon when the solder ball is attached by preventing the warpage of a printed circuit board. CONSTITUTION: A chip is attached to a printed circuit board(1). A wire bonding process is carried out so as to connect a circuit of the printed circuit board(1) to a pad of chip. A molding process is carried out so as to protect the chip and a wire. Then, a baking process is carried out for a predetermined time so as to cure molding resin(4). After attaching a film(6) to an underside of the printed circuit board(1), the underside and the upper side of the printed circuit board(1) are simultaneously molded. After curing molding resin(4), the film(6) attached to the underside of the printed circuit board(1) is removed. Then, a solder ball is attached to an opposite side of the molding portion of the printed circuit board(1). After completing the ball attach, a full cutting process is carried out.</p> |
