| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive lead frame which has a high coupling capability. SOLUTION: This lead frame used for assembling an integrated circuit chip is provided with a base metal structure which has a nickel adhesive layer covering a base metal, a palladium adhesive covering film formed on the nickel layer, and a palladium adhesive layer formed on the palladium covering film, and it selectively covers an area of the lead frame suitable for fitting a bonding wire and soldering. |
